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BRAF-603  Type High Thermal Conductivity Aluminum Base Copper Clad Laminates

CharacteristicHigh thermo conductivity,Low Thermal Expansion,Low Thermal Resistance.Dielectric MaterialStrong Intensity,Low Expansion,High thermo conductivity,High Temperature Resistance.

ApplicationSuch as: High brightness LED,lighting,LCD backlight module,etc. The output amplifier,balanced amplifier,preamplifier,etc.The transistor base,solid state relays,power supply units,etc.Power supply,DC transformer,automobile electrical module,etc.

Aluminum Laminate Type3003/H24 Copper Foil Thickness0.035mm, 0.070mm, 1.05mm Dielectric LayerTC Glue Film Products Thickness0.4mmto 5.0mm Products Size500mmx 1200mm / 1000mm x 1200mm Breakdown VoltageAC 3.0 kv Thermal Stress28860s Thermal Conductivity1.2 W/m.k Peel Strength1.6N/mm Glass Transition140°C  Authentication: UL

 

   

 

BRAF-604  Type High Thermal Conductivity Aluminum Base Copper Clad Laminates

CharacteristicHigh thermo conductivity,Low Thermal Expansion,Low Thermal Resistance.Dielectric MaterialStrong Intensity,Low Expansion,High thermo conductivity,High Temperature Resistance.

ApplicationSuch as: High brightness LED,lighting,LCD backlight module,etc. The output amplifier,balanced amplifier,preamplifier,etc.The transistor base,solid state relays,power supply units,etc.Power supply,DC transformer,automobile electrical module,etc.

Aluminum Laminate Type3003/H24 Copper Foil Thickness0.035mm, 0.070mm, 1.05mm Dielectric LayerTC Glue Film Products Thickness0.4mmto 5.0mm Products Size500mmx 1200mm / 1000mm x 1200mm Breakdown VoltageAC 3.5 kv Thermal Stress28860s Thermal Conductivity1.5 W/m.k Peel Strength1.6N/mm Glass Transition140°C  Authentication: UL

 

 
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