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XPC  Paper Base Copper Clad Laminates

CharacteristicThe product has good heat resistance, leakage resistance, dimensional stability, excellent small warping, at low temperature (40-70 C) process. In line with the demands of UL94V-0 combustion.

ApplicationWidely used in electronic products  Standard Size 40" x 48" / 41" x 49"  Standard Thickness0.4mm-3.2mm  Copper Foil Thickness0.035mm  Product Authentication: UL

 

   

            

FR-1  Paper Base Copper Clad Laminates

CharacteristicThe product has good heat resistance, leakage resistance, dimensional stability, excellent small warping, at low temperature (40-70 C) process. In line with the demands of UL94V-0 combustion.

ApplicationWidely used in electronic products  Standard Size40" x 48" / 41" x 49"  Standard Thickness0.4mm-3.2mm  Copper Foil Thickness0.035mm  Product Authentication: UL

 

 
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