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Polyimide Fabric Copper Clad Laminates




CharacteristicThis product is good heat resistance (Tg-270 C) Z axis expansion coefficients to small,excellent electrical performance.

ApplicationSuitable for high density,high precision and high reliability of circuit board and multilayer circuit board production.

Standard Size36”x 48 “/ 40" x 48" / 41"  x 49" Standard Thickness0.4mm-3.2mm Copper Foil

Thickness0.018mm,0.035mm, 0.070mm Product Authentication: UL

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